Media Summary: Passive align-&-attach operations for polyboard applications at Fraunhofer HHI in Berlin using a The new WaferLine Test product line continues to be rolled out to the first customers worldwide. Starting from the first concept ...

Ficontec Webinar 04 Bondline Customline - Detailed Analysis & Overview

Passive align-&-attach operations for polyboard applications at Fraunhofer HHI in Berlin using a The new WaferLine Test product line continues to be rolled out to the first customers worldwide. Starting from the first concept ...

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ficonTEC - Webinar #04 - BondLine & CustomLine Systems
ficonTEC - Webinar #02 - AssemblyLine & FiberLine Products
ficonTEC - Webinar #03 - Passive vs Active Alignment
ficonTEC – High-volume Manufacturing using In-line AssemblyLine Systems
ficonTEC – Active passive align & attach operations for polyboard operations
ficonTEC – Fully automated fiber ribbon–to connector insertion
ficonTEC - Webinar #13 - Sub-µm Through-Silicon Alignment & Assembly with IR - C. Mittelstaedt (R&D)
ficonTEC - Webinar #11 - PIC Testing with Wafer-level Test Systems
ficonTEC - Webinar #01 -  'ficonTEC 101', Photonics Assembly & Test
ficonTEC - Webinar #10 - High-volume Manufacturing for Photonics
ficonTEC - Next generation In line Photonics Assembly & Test Systems
ficonTEC - Webinar #12 - Fiber Preparation Concept: An Update
View Detailed Profile
ficonTEC - Webinar #04 - BondLine & CustomLine Systems

ficonTEC - Webinar #04 - BondLine & CustomLine Systems

Starting October 21, 2020,

ficonTEC - Webinar #02 - AssemblyLine & FiberLine Products

ficonTEC - Webinar #02 - AssemblyLine & FiberLine Products

Starting October 21, 2020,

ficonTEC - Webinar #03 - Passive vs Active Alignment

ficonTEC - Webinar #03 - Passive vs Active Alignment

ficonTEC

ficonTEC – High-volume Manufacturing using In-line AssemblyLine Systems

ficonTEC – High-volume Manufacturing using In-line AssemblyLine Systems

ficonTEC

ficonTEC – Active passive align & attach operations for polyboard operations

ficonTEC – Active passive align & attach operations for polyboard operations

Passive align-&-attach operations for polyboard applications at Fraunhofer HHI in Berlin using a

ficonTEC – Fully automated fiber ribbon–to connector insertion

ficonTEC – Fully automated fiber ribbon–to connector insertion

ficonTEC

ficonTEC - Webinar #13 - Sub-µm Through-Silicon Alignment & Assembly with IR - C. Mittelstaedt (R&D)

ficonTEC - Webinar #13 - Sub-µm Through-Silicon Alignment & Assembly with IR - C. Mittelstaedt (R&D)

Since October 2020,

ficonTEC - Webinar #11 - PIC Testing with Wafer-level Test Systems

ficonTEC - Webinar #11 - PIC Testing with Wafer-level Test Systems

Since October 2020,

ficonTEC - Webinar #01 -  'ficonTEC 101', Photonics Assembly & Test

ficonTEC - Webinar #01 - 'ficonTEC 101', Photonics Assembly & Test

Starting October 21, 2020,

ficonTEC - Webinar #10 - High-volume Manufacturing for Photonics

ficonTEC - Webinar #10 - High-volume Manufacturing for Photonics

Since October 2020,

ficonTEC - Next generation In line Photonics Assembly & Test Systems

ficonTEC - Next generation In line Photonics Assembly & Test Systems

ficonTEC

ficonTEC - Webinar #12 - Fiber Preparation Concept: An Update

ficonTEC - Webinar #12 - Fiber Preparation Concept: An Update

Since October 2020,

ficonTEC - Webinar #09 -  Waferlevel Test Development Update

ficonTEC - Webinar #09 - Waferlevel Test Development Update

The new WaferLine Test product line continues to be rolled out to the first customers worldwide. Starting from the first concept ...